Electronic device

ABSTRACT

The present disclosure provides an electronic device including a substrate, a conductive element, an extending element and an insulating layer. The substrate includes an edge, the conductive element is disposed on the substrate, the extending element is disposed corresponding to at least a portion of the conductive element and extends to the edge of the substrate, and the insulating layer separates the conductive element and the extending element.

BACKGROUND OF THE DISCLOSURE 1. Field of the Disclosure

The present disclosure relates to an electronic device; moreparticularly, an electronic device capable of reducing damage toconductive elements.

2. Description of the Prior Art

Electronic devices are widely used in daily life, and they have becomean indispensable part of the modern society. As developments of portableelectronic devices continue, consumers would undoubtedly have higherexpectations of their quality, functions or cost-to-performance ratio.

Even though the electronic devices currently on the market may fulfilltheir original design requirements, certain aspects of their functionmay still be lacking. Technical challenges still exist and need to beovercome for these electronic devices.

SUMMARY OF THE DISCLOSURE

An embodiment of the present disclosure provides an electronic deviceincluding a substrate, a conductive element, an extending element and aninsulating layer. The substrate includes an edge, the conductive elementis disposed on the substrate, the extending element is disposedcorresponding to at least a portion of the conductive element andextends to the edge of the substrate, and the insulating layer separatesthe conductive element and the extending element.

These and other objectives of the present disclosure will no doubtbecome obvious to those of ordinary skill in the art after reading thefollowing detailed description of the embodiment that is illustrated inthe various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view of an electronic device according to a firstembodiment of the present disclosure.

FIG. 2 is an enlarged schematic view of a conductive element and anextending element according to the first embodiment of the presentdisclosure.

FIG. 3 is a schematic sectional view along a sectional line A-A′ of FIG.2.

FIG. 4 is an enlarged schematic view of the conductive element and theextending element according to a second embodiment of the presentdisclosure.

FIG. 5 is an enlarged schematic view of the conductive element and theextending element according to a third embodiment of the presentdisclosure.

FIG. 6 is an enlarged schematic view of the conductive element and theextending element according to a fourth embodiment of the presentdisclosure.

FIG. 7 is a schematic sectional view along a sectional line B-B′ of FIG.6.

FIG. 8 is an enlarged schematic view of the conductive element and theextending element according to a fifth embodiment of the presentdisclosure.

FIG. 9 is a schematic sectional view along a sectional line C-C′ of FIG.8.

DETAILED DESCRIPTION

The present disclosure may be understood by reference to the followingdetailed description, taken in conjunction with the embodiments anddrawings as described below. It is noted that, for purposes ofillustrative clarity and being easily understood by the readers, variousdrawings of this disclosure may only partially illustrate an electronicdevice; certain components within may not be drawn to scale. Inaddition, the numbers and dimensions of each component shown in thedrawings are only illustrative and are not intended to limit the scopeof the present disclosure.

Certain terms are used throughout the description and following claimsto refer to particular components. As one skilled in the art willunderstand, electronic equipment manufacturers may refer to a componentby different names. This document does not intend to distinguish betweencomponents that differ in name but not in function. In the followingdescription and in the claims, the terms “include”, “comprise” and“have” are used in an open-ended fashion, and thus should be interpretedto mean “include, but not limited to . . . ”.

It will be understood that when an element or layer is referred to asbeing “on” or “connected to” another element or layer, it can bedirectly on or directly connected to the other element or layer, orintervening elements or layers may be presented (indirect case). Incontrast, when an element is referred to as being “directly on” or“directly connected to” another element or layer, there are nointervening elements or layers presented.

The term “about”, “substantially”, “equal”, or “same” generally refersto values or quantities falling within 20% of a given value or range, orwithin 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

Although terms such as first, second, third, etc., may be used todescribe diverse constituent elements, such constituent elements are notlimited by the terms. The terms are used only to discriminate aconstituent element from other constituent elements in thespecification. The claims may not use the same terms, but instead mayuse the terms first, second, third, etc. with respect to the order inwhich an element is claimed. Accordingly, in the following description,a first constituent element may be a second constituent element in aclaim.

It should be noted that the technical features in different embodimentsdescribed in the following description may be replaced, recombined, ormixed with one another to constitute another embodiment withoutdeparting from the spirit of the present disclosure.

An electronic device according to the present disclosure may include adisplay device, an antenna device, a sensing device, a light-emittingdevice, a tiled device, other suitable devices or a combination of theaforementioned devices, but not limited thereto. The electronic devicemay include foldable or flexible electronic devices. In one embodiment,the electronic device may include a display medium and/or alight-emitting unit. For example, the electronic device may include aliquid crystal layer or a light-emitting diode. The light-emitting diodemay include organic light-emitting diodes (OLEDs), inorganiclight-emitting diodes such as mini light-emitting diodes (mini LEDs) ormicro light-emitting diodes (micro LEDs), quantum dots, quantum dotlight-emitting diodes (quantum dot LEDs, QLEDs, QDLEDs), fluorescentmaterials, phosphorescent materials, other suitable materials or acombination of the above materials and devices, but not limited thereto.In the description below, a display device is illustrated as an exampleof the electronic device of the present disclosure, but the presentdisclosure is not limited thereto.

Please refer to FIG. 1, which shows a top view of an electronic deviceaccording to a first embodiment of the present disclosure. An electronicdevice 10 may include a substrate 100, at least one conductive element102 and at least one extending element 104, but not limited thereto. Thesubstrate 100 may include an operating region R1 and a peripheral regionR2; the peripheral region R2 may for example be disposed on at least oneside of the operating region R1. As shown in FIG. 1, the peripheralregion R2 may surround the operating region R1. The operating region R1may include a display region, a detecting region, a sensing region, alight-emitting region, or a combination thereof, but not limitedthereto.

The substrate 100 may include a rigid substrate, a soft substrate (suchas a bendable or deformable substrate) or a combination of the above,but not limited thereto. In some embodiments, materials of the substrate100 may include plastics, glass, quartz, organic polymers, metals,ceramics, other suitable materials, or a combination of the above, butnot limited thereto. If the material of the substrate 100 is an organicpolymer, the material may for example include polyimide (PI),polyethylene terephthalate (PET), polycarbonate (PC) or a combination ofthe above, but not limited thereto.

As shown in FIG. 1, the substrate 100 may include a region R21, and theregion R21 may be adjacent to an edge E1 of the substrate 100. Forexample, the region R21 may be located in the peripheral region R2 ofthe substrate 100, but not limited thereto. The conductive element 102and the extending element 104 may be disposed on the substrate 100 andinside the region R21, and the conductive element 102 and the extendingelement 104 may be disposed adjacent to the edge E1 of the substrate100. For example, the extending element 104 may extend to the edge E1 ofthe substrate 100. The region R21 may include a lead region (e.g. atrace region) and/or a bonding region, such as an outer lead bonding(OLB) region, but not limited thereto. The conductive element 102 mayfor example be connected to leads (not drawn) on the substrate 100, andallow the conductive element 102 to be electrically connected tocomponents and elements in the electronic device 10, but not limitedthereto. On the other hand, for example, during the production processof the electronic device 10, a plurality of electronic devices 10 may bemanufactured together on a large size substrate, and the plurality ofelectronic devices 10 may subsequently be separated by a cuttingprocess. During the production process of manufacturing the plurality ofelectronic devices 10 on the large size substrate, damages may occur inthe conductive element 102 due to electrostatic charge accumulation;therefore, extending elements may be disposed for connecting to agrounding lead to release the electrostatic charge. The grounding leadand a portion of the extending element may be removed during the cuttingprocess, and the extending element 104 of FIG. 1 may be the remainingportion of the extending element after the plurality of electronicdevices 10 are separated, but the present disclosure is not limitedthereto. In other embodiments, the extending element may have additionalfunctions. Furthermore, the electronic devices 10 may not bemanufactured together on the large size substrate; instead, a singleelectronic device 10 may be manufactured.

Please refer to FIG. 2 and FIG. 3. FIG. 2 is an enlarged schematic viewof the conductive element and the extending element according to thefirst embodiment of the present disclosure. To improve readability andclarity, FIG. 2 only shows the conductive elements 102 and the extendingelements 104 on the substrate 100. Additionally, FIG. 3 is a schematicsectional view along a sectional line A-A′ of FIG. 2. As shown in FIG.2, the conductive elements 102 arranged from left to right may include aconductive element 1021 to a conductive element 1024, and the extendingelements 104 arranged from left to right may include an extendingelement 1041 to an extending element 1044, but the quantity, sequence orshapes of the conductive elements 102 and the extending elements 104 arenot limited thereto.

For example, the conductive element 1021 may be connected to theconductive element 1022, but not limited thereto; the conductive element1021 and the conductive element 1022 may also be independent andseparated from each other. The conductive element 1023 may be connectedto the conductive element 1024 and extends diagonally (or obliquely)with the conductive element 1024, but not limited thereto; theconductive element 1023 may also not be connected to the conductiveelement 1024, and the conductive element 1023 and the conductive element1024 may each extend diagonally and be independent from each other.Furthermore, one or more dummy conductive elements 106 may be disposedon the substrate 100, and the dummy conductive element 106 may beelectrically isolated from the conductive elements and the extendingelements, but not limited thereto.

At least one of the extending elements 1041 to the extending element1044 may be disposed corresponding to at least a portion of one of theconductive elements 1021 to the conductive element 1024. For example,the extending element 1041 may be disposed corresponding to theconductive element 1021, but the present disclosure is not limitedthereto. In other embodiments, a plurality of extending elements maycorrespond to one conductive element. A portion of the extendingelements and/or a portion of the conductive elements may beindependently disposed without a corresponding conductive element and/ora corresponding extending element.

At least one of the extending elements 1041 to the extending element1044 may include a first portion 104 a and a second portion 104 b, butnot limited thereto. As shown in FIG. 2, for example, the extendingelement 1041 may overlap a portion of the conductive element 1021,wherein a region of the extending element 1041 overlaps the conductiveelement 1021. The overlapping region may be defined as a first portion104 a (such as a region between an edge E41 of the extending element andan edge E21 of the conductive element), and another region of theextending element 1041 does not overlap the conductive element 1021,whereas the another region may be defined as a second portion 104 b, butnot limited thereto. The extending element 1044 may have the samefeatures as the aforementioned extending element 1041, but not limitedthereto.

In another embodiment, an edge E42 of the extending element 1042 may bedisposed corresponding to an edge E22 of the conductive element 1022,the conductive element 1022 does not overlap the extending element 1042,and the edge E22 may be separated from the edge E42. A distance betweenthe edge E22 and the edge E42 may be between 0.05 micrometers and 0.5micrometers (0.05 micrometers ≤distance ≤0.5 micrometers), such as 0.1micrometers, 0.2 micrometers, 0.3 micrometers, or 0.4 micrometers, butnot limited thereto.

In another embodiment, an edge E43 of the extending element 1043 may bedisposed corresponding to an edge E23 of the conductive element 1023,wherein the conductive element 1023 does not overlap the extendingelement 1043, and the edge E23 is substantially aligned with the edgeE43. In other words, the extending element 1042 and the extendingelement 1043 may not overlap the conductive element 1022 and theconductive element 1023.

The aforementioned term “overlap” may refer to different film layersoverlapping each other in a normal direction D3 of a surface of thesubstrate 100, but not limited thereto. Unless otherwise specified, theterm “overlap” in the present disclosure refers to a “completelyoverlapping” configuration and a “partially overlapping” configuration.

In some embodiments (as shown in FIG. 2), the shape of the extendingelement 104 may be a “T” shape or other suitable shapes, but not limitedthereto. Using the extending element 1041 as an illustrative example,the first portion 104 a may have a first width W1, the second portion104 b may have a second width W2, and the second width W2 may be lessthan the first width W1. In the present disclosure, the first width W1may be the minimum width of the first portion 104 a, the second width W2may be the minimum width of the second portion 104 b. Furthermore, inone embodiment, the width of the extending element 1041 (such as thefirst width W1 or the second width W2) may be less than or equal to awidth W3 of the conductive element 1021. For example, the first width W1of the extending element 1041 may be substantially equal to the width W3of the conductive element 1021, but not limited thereto.

The width W3 of the conductive element 1021 and the width of theextending element 1041 (such as the first width W1 or the second widthW2) may for example be measured by first taking the edge E21 of theconductive element 1021 as a basis, then, defining a maximum width ofthe conductive element 1021 measured within a range of 200 micrometersfrom the edge E21 along a first direction D1 (such as an extensiondirection of the extending element 1041) as the width W3, and defining aminimum width of the extending element 1041 measured within a range of200 micrometers from the edge E21 along a direction opposite to thefirst direction D1 as the width of the extending element 1041, but notlimited thereto.

In other embodiments, the extending element 1042 and the extendingelement 1043 may respectively include a third portion 105 a and a fourthportion 105 b. A minimum width of the third portion 105 a may be greaterthan a maximum width of the fourth portion 105 b, but not limitedthereto. The fourth portion 105 b may be disposed between the thirdportion 105 a and the edge E1 of the substrate 100.

Configuring the second width W2 of the second portion 104 b of theextending element 1041 to be less than the first width W1 of the firstportion 104 a may reduce the area of the extending element 1041 exposedat the edge E1 of the substrate 100, thereby reducing the probability ofcorrosion due to moisture and oxygen. On the other hand, configuring thesecond portion 104 b to be closer to the edge E1 of the substrate 100and with a narrow width increases the resistivity of the second portion104 b, and the electrostatic charges are less likely to pass through thesecond portion 104 b. For example, when an excessive number ofelectrostatic charges accumulate at the second portion 104 b, the secondportion 104 b may be more likely to be damaged by static electricity,whereas the first portion 104 a or the conductive element 1021 away fromthe edge E1 are less likely to be damaged by the static electricity; inthis manner, the conductive element 1021 may be protected. Theadvantages described above are for illustrative purposes only; contentsof the present disclosure are not limited thereto, and additionaladvantages or functions may be present depending on product design orrequirements.

As shown in FIG. 3, in some embodiments, the conductive element 1021 mayinclude a first conductive layer, the extending element 1041 may includea second conductive layer, the first conductive layer may be disposed onthe substrate 100, and the second conductive layer may be disposed onthe first conductive layer, but not limited thereto. The firstconductive layer and the second conductive layer of the presentembodiment may for example include a metal layer, but not limitedthereto. Materials of the first conductive layer and the secondconductive layer may include metals, transparent conductive materials ora combination of the abovementioned materials, but not limited thereto.

The abovementioned transparent conductive materials may include indiumtin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide(IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), antimonyzinc oxide (AZO), other suitable transparent conductive materials or acombination of the abovementioned materials, but not limited thereto.

The aforementioned metals may include copper (Cu), aluminum (Al),titanium (Ti), gold (Au), tin (Sn), silver (Ag), molybdenum (Mo),silicon (Si), other suitable metals or a combination of theabovementioned materials, but not limited thereto. Additionally, theconductive element 1021 and/or the extending element 1041 of FIG. 3 mayinclude a single-layer structure, but not limited thereto. In otherembodiments, the conductive element 1021 and/or the extending element1041 may include a multi-layer structure.

As shown in FIG. 3, in the normal direction D3 of the surface of thesubstrate 100, the insulating layer 108 may be disposed on the substrate100 and be disposed between the conductive element 1021 and theextending element 1041. In other words, the insulating layer 108 mayseparate the conductive element 1021 and the extending element 1041. Athickness of the insulating layer 108 may be between 0.05 micrometersand 0.7 micrometers (0.05 micrometers ≤thickness ≤0.7 micrometers), suchas 0.1 micrometers, 0.2 micrometers, 0.3 micrometers, 0.4 micrometers,or 0.5 micrometers, but not limited thereto and may be adjusteddepending on practical demands. In some embodiments, the thickness maybe a maximum thickness in the normal direction D3 of the substrate 100in any given sectional view.

An insulating layer 110 may be disposed on the second conductive layer(the extending element 1041). Materials of the insulating layer 108 andthe insulating layer 110 may include silicon oxide, silicon nitride,other suitable insulating materials or a combination of theabovementioned materials, but not limited thereto. Since the conductiveelement 1021 and the extending element 1041 may be separated by theinsulating layer 108, and the conductive element 1021 may be covered bythe insulating layer 108, the insulating layer 108 may provide aprotective barrier for the conductive element 1021, for example, toreduce the probability of the conductive element 1021 being corroded bymoisture and oxygen. The insulating layer 108 and/or the insulatinglayer 110 may include a single-layer structure, but not limited thereto.In other embodiments, the insulating layer 108 and/or the insulatinglayer 110 may include a multi-layer structure.

As shown in FIG. 3, the conductive layer 112 may be disposed on theinsulating layer 110; for example, the conductive layer 112 may extendfrom above the conductive element 1021 of FIG. 2 to above the firstportion 104 a and the second portion 104 b of the extending element1041, but not limited thereto. In one embodiment, the conductive layer112 may at least partially expose an area above the second portion 104b, but not limited thereto. In one embodiment, materials of theconductive layer 112 may include metals or transparent conductivematerials, but not limited thereto. The conductive layer 112 may protectthe conductive element 1021 (such as to reduce corrosion), but notlimited thereto.

Furthermore, the first portion 104 a of the extending element 104 mayinclude at least one opening, but not limited thereto. As shown in FIG.2 and FIG. 3, the second portion 104 b of the extending element 1041 mayinclude a plurality of openings 120, and the opening 120 may for examplebe arranged along a second direction D2, but not limited thereto. Inother embodiments, the opening 120 may be arranged in a matrix, such asan M×N matrix (for example, a 1×5, 2×2, or 3×2 matrix), and M and N maybe integers greater than or equal to 1, but not limited thereto. Thefirst direction D1 may be different from the second direction D2; forexample, the first direction D1 may substantially be perpendicular tothe second direction D2, but not limited thereto. The opening 120 maypenetrate the second conductive layer (the extending element 1041) andthe insulating layer 108, and the insulating layer 110 may partially orcompletely fill the opening 120, but not limited thereto. Disposing theopenings 120 inside the extending element 1041 may slow the ingress ofmoisture and oxygen, thereby protecting the conductive element 1021.

On the other hand, the conductive element 102 may include at least onecontact hole, but not limited thereto. As shown in FIG. 2, theconductive element 1021 may include a plurality of contact holes 114,and the contact holes 114 may for example be arranged along an extensiondirection of the conductive element 102, but not limited thereto. Thecontact holes 114 may for example penetrate the insulating layer 108 andthe insulating layer 110 on the conductive element 1021 of FIG. 3 andexpose the conductive element 1021, and the conductive element 1021 maybe electrically connected to a bonding pad of other electrical elements(such as an integrated circuit chip, a flexible circuit board, etc.),but not limited thereto. In one embodiment, the conductive element 1021may be connected to the conductive layer 112 through the contact holes114, and the conductive element 1021 may be electrically connected toother electrical elements through the conductive layer 112.

The abovementioned features of the conductive element 1021 and theextending element 1041 may be applied to at least one of the remainingconductive elements 1022 to the conductive elements 1024 of FIG. 2 andat least one of the remaining extending elements 1042 to the extendingelements 1044 of FIG. 2, and further description is omitted herein forsimplicity. Additionally, structures of the electronic device 10 are notlimited to those shown in sectional views of the present disclosure(such as FIG. 3 and subsequent FIG. 7 and FIG. 9); in the sectionalviews, other suitable film layers may be disposed between different filmlayers or disposed above the top film layer depending on various designrequirements.

Descriptions below will detail other embodiments of the presentdisclosure; for simplicity, identical reference signs will be used foridentical components. To emphasize differences between variousembodiments, the following paragraphs will focus on describing suchdifferences between the various embodiments and will not describeredundant technical features.

Please refer to FIG. 4, which is an enlarged schematic view of theconductive element and the extending element according to a secondembodiment of the present disclosure. The present embodiment differsfrom the first embodiment in that, the extending element 104 of thepresent embodiment includes at least one bent region. As shown in FIG.4, the second portion 104 b of the extending element 104 may include aplurality of bent regions BP, and the shape of the second portion 104 bmay be similar to a winding extended hose, but not limited thereto. Inthe present embodiment, the extending element 104 includes the bentregions BP that substantially extend in the first direction D1 (as shownin FIG. 4). Electrostatic charges accumulate more easily in the bentregions BP, and when an excessive number of electrostatic chargesaccumulate at the bent regions BP, the bent regions BP may be damaged bystatic electricity first, and the first portion 104 a or the conductiveelement 102 away from the edge E1 are less likely to be damaged by thestatic electricity, and the conductive element 102 may be protected.

Furthermore, the width of the extending element 104 of the presentembodiment (such as the first width W1 and/or the second width W2) maybe less than the width W3 of the conductive element 102, but not limitedthereto. In one embodiment, the bent region BP may have an angle θ, andthe range of the angle θ may be between 30° to 120° (30°≤angle θ≤120°),such as 45°, 60°, 75°, 90°, or 105°, but not limited thereto.

Please refer to FIG. 5, which is an enlarged schematic view of theconductive element and the extending element according to a thirdembodiment of the present disclosure. The present embodiment differsfrom the first embodiment in that, extending elements 1045 and extendingelements 1046, respectively, may extend along and overlap the conductiveelements 1025 and the conductive elements 1026. The extending element1045 may not have the second portion 104 b and/or the opening 120 of theextending element 104 in the first embodiment, but not limited thereto.The second portion 104 b of the extending element 1046 may include aplurality of bent regions BP, but not limited thereto. Furthermore, thefirst width W1 of the extending element 1045 and the extending element1046 of the present embodiment may respectively be greater than or equalto the width W3 of the conductive element 1025 and the conductiveelement 1026, but not limited thereto. In one embodiment, the width maybe a maximum width perpendicular to the first direction D1. In oneembodiment, the bent region BP may have an angle θ, and the range of theangle θ may be between 30° to 120° (30°≤angle θ≤120°), such as 45°, 60°,75°, 90°, or 105°, but not limited thereto.

Please refer to FIG. 6 and FIG. 7. FIG. 6 is an enlarged schematic viewof the conductive element and the extending element according to afourth embodiment of the present disclosure, and FIG. 7 is a schematicsectional view along a sectional line B-B′ of FIG. 6. The presentembodiment differs from the first embodiment in that, in FIG. 6, theopenings 120 disposed in the first portion 104 a of the extendingelement 104 are arranged in a matrix, but not limited thereto.Additionally, as shown in FIG. 7, the extending element 104 of thepresent embodiment may include the first conductive layer, theconductive element 102 may include the second conductive layer, and thesecond conductive layer is disposed on the first conductive layer, butnot limited thereto. In one embodiment, as shown in FIG. 6 and FIG. 7,the first portion 104 a of the extending element 104 may overlap theconductive element 102, the opening 120 may penetrate the conductiveelement 102, the insulating layer 108 and the first portion 104 a of theextending element 104, and the insulating layer 110 may partially orcompletely fill the opening 120, but not limited thereto.

Please refer to FIG. 8 and FIG. 9. FIG. 8 is an enlarged schematic viewof the conductive element and the extending element according to a fifthembodiment of the present disclosure, and FIG. 9 is a schematicsectional view along a sectional line C-C′ of FIG. 8. The presentembodiment differs from the first embodiment in that, the conductiveelement 102 of the present embodiment (as shown in FIG. 8) may include amain portion 102 a and a protrusion portion 102 b. The protrusionportion 102 b may be disposed between the main portion 102 a and theedge E1 of the substrate 100, and the protrusion portion 102 b mayextend to the edge E1, but not limited thereto. A width of the mainportion 102 a may be greater than a width of the protrusion portion 102b, but not limited thereto. The contact holes 114 may be disposed insidethe main portion 102 a, but not limited thereto. For example, theprotrusion portion 102 b of the conductive element 102 may serve as atesting lead during the production process of the electronic device 10,and a portion of the lead may be removed during the cutting process,whereas the protrusion portion 102 b of FIG. 8 may be a portion of theremaining lead after the electronic device 10 is cut and separated.

In the present embodiment (as shown in FIG. 8 and FIG. 9), the extendingelement 104 may overlap the protrusion portion 102 b of the conductiveelement 102. In one embodiment, the extending element may only have aportion that overlaps the conductive element 102. The extending element104 may extend to the edge E1 along the protrusion portion 102 b of theconductive element 102, but not limited thereto. The extending element104 may include a multi-layer structure. For example, the extendingelement 104 may include a conductor layer 116 and a semiconductor layer118, and the conductor layer 116 may be disposed on the semiconductorlayer 118. A portion of the semiconductor layer 118 may overlap theconductor layer 116, but not limited thereto. At least one of theconductor layer 116 and the semiconductor layer 118 may extend to theedge E1 of the substrate 100.

For example, the conductor layer 116 may include a metal layer, whereasthe semiconductor layer 118 may include an indium gallium zinc oxide(IGZO) layer, an amorphous semiconductor layer, a polycrystallinesemiconductor layer, or other suitable semiconductor layers, but notlimited thereto. Furthermore, the extending element 104 of the presentembodiment may not have the opening 120 of the first embodiment, but notlimited thereto. In the present embodiment (as shown in FIG. 9), theextending element 104 may be disposed between the insulating layer 110,but not limited thereto. The insulating layer 110 may include a siliconoxide layer, whereas the insulating layer 108 may include a siliconnitride layer, but not limited thereto.

In summary, the conductive elements and the extending elements of theelectronic device of the present disclosure may be separated by theinsulating layer, and the conductive elements may be covered by theinsulating layer; in this manner, the insulating layer may provide theprotective effect to the conductive elements, for example, by reducingthe probability of the conductive element being corroded by moisture andoxygen.

Even though embodiments and advantages of the present disclosure havebeen described as above, it should be understood that those skilled inthe art may modify, substitute or amend features of the presentdisclosure depending on design requirements without departing from theessence and scope of the present disclosure, so long as an essence ofthe disclosure is maintained.

Additionally, the scope of the present disclosure is not limited to theproduction process, equipment, manufacture, composition, device, methodor procedure outlined for a particular embodiment within thedescription. Those skilled in the art may infer from the content of thepresent disclosure about the production process, equipment, manufacture,composition, device, method or procedure, that are currently availableor may be developed in the future, so long as the embodiments describedherein may be used to realize substantially similar functions oroutcome.

Therefore, the scope of protection of the present disclosure includesthe aforementioned production process, equipment, manufacture,composition, device, method or procedure. Furthermore, every claimconstitutes a separate embodiment, and the scope of the presentdisclosure also includes combinations of every claim and embodiment. Thescope of the present disclosure is defined by the claims herein. Any oneembodiment or claim of the present disclosure does not need to containall of the advantages, features or meet all of the aims or goals of thepresent disclosure.

What is claimed is:
 1. An electronic device, comprising: a substrate,comprising an edge; a conductive element disposed on the substrate; anextending element disposed corresponding to at least a portion of theconductive element and extending to the edge of the substrate; and aninsulating layer separating the conductive element and the extendingelement.
 2. The electronic device of claim 1, wherein a width of theextending element is less than a width of the conductive element.
 3. Theelectronic device of claim 1, wherein a region of the extending elementoverlapping the conductive element is defined as a first portion, thefirst portion has a first width, another region of the extending elementnot overlapping the conductive element is defined as a second portion,the second portion has a second width, and the second width is less thanthe first width.
 4. The electronic device of claim 3, wherein the firstportion of the extending element comprises at least an opening.
 5. Theelectronic device of claim 1, wherein the conductive element does notoverlap the extending element.
 6. The electronic device of claim 1,wherein the extending element comprises at least one bent region.
 7. Theelectronic device of claim 6, wherein the at least one bent region hasan angle, and the angle is greater than or equal to 30° and less than orequal to 120°.
 8. The electronic device of claim 1, wherein theextending element comprises a metal layer and a semiconductor layer, andthe metal layer is disposed on the semiconductor layer.
 9. Theelectronic device of claim 1, wherein the insulating layer comprises asingle-layer structure or a multi-layer structure.
 10. The electronicdevice of claim 1, wherein the conductive element comprises at least acontact hole.